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Abstract
Quartz glass has a wide range of application and commercial value due to its high light transmittance and stable chemical and physical properties. However, due to the difference in the characteristics of the material itself, the adhesion between the metal micropattern and the glass material is limited. This is one of the main things that affect the application of glass surface metallization in the industry. In this paper, micropatterns on the surface of quartz glass are fabricated by a femtosecond laser-induced backside dry etching (fs-LIBDE) method to generate the layered composite structure and the simultaneous seed layer in a single-step. This is achieved by using fs-LIBDE technology with metal base materials (Stainless steel, Al, Cu, Zr-based amorphous alloys, and W) with different ablation thresholds, where atomically dispersed high threshold non-precious metals ions are gathered across the microgrooves. On account of the strong anchor effect caused by the layered composite structures and the solid catalytic effect that is down to the seed layer, copper micropatterns with high bonding strength and high quality, can be directly prepared in these areas through a chemical plating process. After 20-min of sonication in water, no peeling is observed under repeated 3M scotch tape tests and the surface was polished with sandpapers. The prepared copper micropatterns are 18 µm wide and have a resistivity of 1.96 µΩ·cm (1.67 µΩ·cm for pure copper). These copper micropatterns with low resistivity has been proven to be used for the glass heating device and the transparent atomizing device, which could be potential options for various microsystems.
© 2022 Optica Publishing Group under the terms of the Optica Open Access Publishing Agreement
1. Introduction
Glass is a widely used amorphous nonmetallic material with many valuable properties, such as high transparency, high strength, high rigidity and abrasion resistance. For these properties, glass is one of the widely used materials in many industrial fields. If the glass is electrically conductive, it can be used in various fields such as the aerospace industry, medical field and electronic display [1–5]. However, due to the difference in the characteristics of the material itself, the adhesion between the metal micropattern and the glass material is limited. This is one of the main reasons that affect the application of glass surface metallization in industry. Selective metallization of glass surfaces has spawned many technical applications, such as using indium tin oxide [6], electronic printing [7], electroless copper plating [8,9] and laser processing [10–12].
Indium tin oxide (ITO) technology consists of the selective removal of sputtering from the glass surface by wet etching or laser etching of ITO [13]. Nevertheless, it has disadvantages such as low conductivity, low efficiency and high production cost [6]. Electronic printing technology is one of the main methods used to generate conductive micropatterns on the glass on account of its simple method. However, the conductivity is low and the adhesion to the base material is limited. Therefore, chemical copper plating is more widely used due to the simplicity and cost-effectiveness of the process [14]. Whereas, this method lacks selectivity because the copper prepared by chemical plating adheres to the entire substrate material.
In recent years, laser processing methods have been used extensively for selective patterning and local structuring which can achieve small-size metal deposition in selected areas without photomasks or pretreatment [15–19]. Laser-induced chemical liquid phase deposition (LCDD) is an easy-to-operate and process-simple method for selective metallization on glass [20,21]. However, this method has problems such as limited adhesion and conductivity due to incomplete reactions or side reactions under laser irradiation [22]. According to the available studies, few studies have been conducted to ensure the durability of the LCDD method for selective metallization deposition of copper on glass materials [23]. Therefore, the preparation of robust metallic micropatterns by selective metallization on glass surfaces remains a pressing problem.
In this study, we investigated a femtosecond laser-induced backside dry etching (fs-LIBDE) process with different materials as substrate materials. The effects of structure and active layer on the selective metallization of quartz glass surfaces were discussed. We have demonstrated that in the method of fabricating metallic micropatterns on quartz glass surfaces by fs-LIBDE using metallic materials as substrates, high threshold non-precious metal materials can be used to reduce the cost. This method is simpler and easier than the conventional process and produces circuit micropatterns with good electrical conductivity and adhesion on the glass surface by selective metallization.
2. Experimental
2.1 Materials
Materials. JGS1 UV grade quartz glass (from Tianjin Ratel Int’l Trade Co., China), polyimide (PI, from Meixin Co., China), silicon carbide (SiC, from Beijing TankeBlue Semiconductor Co., China), stainless steel, aluminum (Al), copper (Cu), tungsten (W) and Zr-based amorphous alloys (from Foshan Guoshengwei Metal Products Co., China) with a thickness of 1 mm are polished on both sides. The JGS1 UV-grade quartz glass contains 99.99 wt.% SiO2 and 0.01 wt.% impurities. The formaldehyde solution (concentration 37%∼40%), disodium EDTA, anhydrous copper sulfate and other chemicals used in the experiments were chemically pure (from Aladdin, China) with impurity content <0.5 wt.%.
2.2 Processing
Femtosecond laser direct etching (fs-LDE, Fig. 1(a1)) and fs-LIBDE (Fig. 1(a2)) are performed using a configuration that includes a femtosecond laser (PHAROS from Light Conversion, wavelength (λ) 1030 nm, pulse duration (τ) 290 fs, repetition rate (f) 10 kHz) and a 10X infinity-corrected objective with N.A of 0.26 (Mitutoyo) to focus the laser beam. The laser beam has a focused beam diameter of 11 µm. The base material used in the fs-LIBDE are insulators (Polyimide, PI), semiconductors (SiC) and conductors (Stainless steel, Al, Cu, Zr-based amorphous alloys, W), where the substrate material is directly attached to the quartz glass surface. Gold spraying in the groove before chemistry plating is done by automatic gold plating and carbon plating combination instrument for the 30 s about several tens of nanometers thick. Various machining motion paths are realized by computer-controlled X-Y moving stages (Aerotech ANT130) and machining is observed online using coaxial CCD.
Fig. 1. Experimental flow chart of producing metal micro-patterns on the surface of quartz glass by femtosecond laser-induced selective metallization; (a1) fs-LDE; (a2) fs-LIBDE; (b) chemical plating; (c) the four-point probe measurement.
In our work, the chemical plating solution mainly consisted of anhydrous copper sulfate (17 g/L) as a Cu2+ ion source, disodium EDTA (33 g/L) as a complexing agent, formaldehyde (27 ml/L) as a reducing agent, and 2.2-bipyridine (10 ml/L) as an additive. The plating solution was configured in an alkaline environment (pH = 12.7) by selecting a sodium hydroxide solution with a concentration of 5 mol/L. As shown in Fig. 1(b), the LDE- and fs-LIBDE-passed samples are immersed in the chemical plating solution and deposited using a 70°C water bath heated for 30 min to prepare metal micropatterns. Magnetic stirring is also used to maintain the uniform distribution of copper ions and to ensure the homogeneity of the metal micropatterns. Finally, the prepared samples are ultrasonically cleaned with deionized water and dried in a vacuum compressor. A Keithley 2410 source meter was used to test the resistance, and five specimens of each sample were measured (Fig. 1(c)).
2.3 Characterization
3D contours of microgrooves and metal patterns fabricated by fs-LDE and fs-LIBDE are measured using a laser scanning confocal microscope (OLS4000 series from Olympus). Sample performance morphology is analyzed using an optical microscope (CX40M from Sunny) and a scanning electron microscope (SEM, SU8010 from Hitachi). In addition, energy dispersive spectroscopy (EDS) with SEM is used to quantify the elemental distribution and chemical composition ratios in the microgrooves and Cu circuits. The specific components of the metal block samples and fs-LIBDE's quartz glass samples are analyzed using X-ray photoelectron spectroscopy (XPS, Escalab 250Xi, Thermo Fisher Scientific, England). The binding energies are calibrated by the C1s binding energy of 284.7 eV. The resistance of the copper patterns was confirmed by measuring the current after connecting the copper patterns to a DC power and changing the applied voltage from low to high.
2.4 Formation principles of selective metal seed layers for chemical plating
Chemical plating is a method of forming a dense coating on the surface of various materials without the need for electricity, based on the principle of redox reaction. In order to obtain a good chemical coating, it is necessary to satisfy the surface microstructure with certain morphology and the metal activation layer that promotes the reaction of metal ions [24]. Therefore, the fs-LIBDE process is used to treat the surface of the quartz glass, as shown in Fig. 2. When the laser beam is focused and irradiated on the surface of the substrate material, a plasma is generated and acts simultaneously on the backside of the quartz glass (Fig. 2(b)) [25]. The plasma further isothermally expands due to the inverse bremsstrahlung absorption of subsequent pulse laser energy [26]. As a result, the plasma acts on the back surface of the quartz glass, causing the glass to heat up, melt or even vaporize to achieve glass etching (Fig. 2(c)) [27]. At the same time, a laser-induced plasma plume impinges on the surface of the substrate material, flaking and driving the substrate material particles to move at high speed and deposit on the back surface of the glass substrate, forming a chemically deposited seed layer.
3. Results and discussion
3.1 Effect of structure and seed layers on deposition
To verify the role of microstructures in chemical deposition, rough microgrooves and smooth microgrooves were prepared on the surface of quartz glass using fs-LDE. Figure 3(a) presented the images of the prepared microstructure microgrooves. By chemical plating, copper deposits could be observed on the rough microgroove surface, but the surface morphology of the deposited microcircuits was not uniform and the hollow phenomenon was obvious, as shown in Fig. 3(b). After spraying gold on the surface of the microgrooves, copper deposits with good morphology could be observed on the surface, as shown in Fig. 3(c). Fig. 3(d) presented the prepared smooth microgrooves. As shown in Fig. 3 (e and f), chemical plating was performed before and after gold spraying on the smooth microgroove surface, and the smooth microgroove surface could hardly be chemically deposited after ultrasonic cleaning. It can be explained that the internal structure of the trench was the dominant factor in achieving deposition and the “seed layer” played a supporting role in improving the quality of the deposited circuit.
Fig. 3. The influence of microstructure and active factors on chemical deposition; (a-c) microstructure groove; (d-f) smooth microgroove; (b, e) no active factor; (c, f) added active factor (sprayed gold); (b-c, e-f) after ultrasonic vibration. Laser parameters: pulse energy = (a: 6.45 µJ), (b 13.3 µJ); laser scanning speed = (a: 5 mm/s), (b: 12 mm/s).
In this section, three types of substrate materials (conductors, semiconductors and insulators) were chosen to prepare microcircuits in order to investigate the effect of substrate materials on the chemical deposition effect, as shown in Fig. 4. Figure 4(a) illustrated the microgrooves and seed layers prepared by fs-LIBDE on the surface of quartz glass. The trenches prepared by the three categories of substrate materials could trigger the oxidation-reduction reaction in the subsequent chemical plating process and copper circuits of a particular morphology were formed at the trenches (Fig. 4(b)). From the durability test results of metallic micropatterns deposited on the glass surface, the adhesion between the glass surface and the deposited metallic micropatterns differed significantly. After ultrasonic vibration and multiple 3M transparent glue tests, the deposition quality was the best when metal (conductor) was used as the substrate material, PI (insulator) the second and SiC (semiconductor) the worst (Figs. 4(c, d)).
Fig. 4. The deposition effect of fs-LIBDE under three categories of substrates; (a) groove topography; (b) surface morphology of deposited copper micropatterns; (c) 20 minutes sonication in water; (d) Multiple 3M Scotch tape tests. Laser parameters: pulse energy = (metal: 8.1 µJ), (SiC: 11.3 µJ), (PI: 12.1 µJ); laser scanning speed = (metal: 10 mm/s), (SiC: 6 mm/s), (PI: 4 mm/s).
3.2 Effect law of metal substrate material on deposition
Based on the experimental results in the previous section, we further analyzed the effect of metal substrates on the preparation of microcircuits. Figure 5 demonstrated the deposition effect of fs-LIBDE under four metal substrates (stainless steel, Al, Cu and Zr-based amorphous alloys). Figure 5(b) illustrated the microgrooves and seed layers prepared by fs-LIBDE on the surface of quartz glass. The trenches prepared by the four categories of substrate materials could trigger the oxidation-reduction reaction in the subsequent chemical plating process and copper circuits of a particular morphology were formed at the trenches (Fig. 5(c)). From the perspective of surface morphology, the Cu micropatterns prepared with Cu and Zr-based amorphous alloys as substrate materials had uniform morphology.
Fig. 5. The deposition effect of fs-LIBDE under four metal substrates; (a) a typical cross-sectional profile of the microgrooves shown in b; (b) groove topography; (c) surface morphology of deposited copper micropatterns; (d) 20 minutes sonication in water; (e) Multiple 3M scotch tape tests. Laser parameters: pulse energy = (stainless steel, Al and Zr-based amorphous alloys: 12.1 µJ), (Cu: 11.5 µJ), laser scanning speed = (stainless steel: 1 mm/s), (Al: 2 mm/s), (Cu, Zr-based amorphous alloys: 4 mm/s).
The bond strength of these deposited metal micropatterns was further tested using two different methods. Figure 5(d) showed the surface morphology of the deposited metal micropatterns after ultrasonic cleaning of the samples in deionized water for 20 min (system power: 180 W). After ultrasonic cleaning in deionized water for 20 min, the surface morphology of the deposited metal micropatterns was intact. After 5 times 3M scotch tape test, the copper circuit's surface morphology was destroyed and the local copper circuit was peeled off due to insufficient adhesion (Fig. 5(e)). However, the surface morphology of the copper circuit prepared with Zr-based amorphous alloys as the substrate material had not changed. In conclusion, the copper micropattern was prepared with Zr-based amorphous alloys as the substrate material was applied and tested without peeling and damage to the surface morphology of the copper micropattern.
We further measured the resistance of the copper micropatterns shown in Fig. 5(e). Separate 20 mm long copper micropatterns prepared from different substrates were selected and their resistances were measured. If we assume the copper layer is a uniform layer with a thickness of 5 µm. The cross-sectional area of the microgroove is calculated from Fig. 5(a). The calculated resistivity was 9.56 µΩ·cm (stainless steel substrate), 6.33 µΩ·cm (Al substrate), 4.12 µΩ·cm (Cu substrate) and 1.96 µΩ·cm (Zr-based amorphous alloys substrate), respectively. According to the analysis results of the surface morphology, adhesion and conductivity of the copper micropatterns, the copper micropatterns deposited with Zr-based amorphous alloys as the substrate material had the best quality.
It could be seen from the above that the copper microcircuit prepared with Zr-based amorphous alloys as the substrate material was provided with excellent characteristics. For example, the resistivity was 1.96 µΩ·cm, which was close to the resistivity of the bulk copper. At the same time, the surface morphology of copper micropattern was almost unchanged after ultrasonic treatment in deionized water for 20 min and multiple 3M tape tests. Therefore, the performance of the copper micropattern could meet the application requirements in the industry.
3.3 Mechanism for the formation of robust metallic micropatterns
As depicted in Fig. 6, microgrooves were prepared on the surface of quartz glass by fs-LIBDE to study the role of different substrate materials in the copper deposition. The bottom and edge regions of the microgrooves were prepared with stainless steel as the substrate material had nanosphere structures (Figs. 6(a)–6(a2)). The bottom and edge regions of the microgrooves prepared with Al and Cu as substrate materials were ripples structures ( Figs. 6(b)–6(b2) and 6(c)–6(c2)). A small number of nanosphere structures were attached to the bottom and edge regions of the microgrooves prepared with Cu as substrate material. The bottom and edge regions of the microgrooves prepared with Zr-based amorphous alloys as the substrate material were a layered composite structure consisting of a ripples structure and a large number of nanosphere structures (Figs. 6(d)–6(d2)). Therefore, when Zr-based amorphous alloys were used as the substrate material, the layered composite structure was prepared by fs-LIBDE, which provided a stronger anchor effect for chemical deposition.
Fig. 6. SEM images of microgrooves prepared by LIBDE under four metal substrate materials; (a) stainless steel; (b) Al; (c) Cu; (d) Zr-based amorphous alloys; (a1-d1and a2-d2) Partial magnification of SEM images; (a-d) groove topography; Laser parameters: pulse energy = (a, b and d: 12.1 µJ), (c: 11.5 µJ), laser scanning speed = (a: 1 mm/s), (b: 2 mm/s), (c and d: 4 mm/s).
XPS was employed to determine the specific composition of the main metals in the metal block samples and quartz glass samples of fs-LIBDE. Figures 7(a-d) and Figs. 7(a1-d1) separately show the main metal elemental: Fe2p, Al2p, Cu2p and Zr3d energy spectra obtained after conducting high-resolution spectral peak separation on the metal block samples and quartz glass samples of fs-LIBDE. By observing the energy spectra in Fig. 7 and the comparison table of XPS binding energy [28], it can be determined that the spectral peaks correspond to the binding energy of the main metal substances respectively. By comparing the changes in the chemical valence of the main metals before and after fs-LIBDE, it can be seen that the metal monomers on the surface of the trench after fs-LIBDE were reduced and became corresponding positive valence substances attached to the surface of the trench according to their own nature. That is, it played a catalytic role in the chemical deposition process and increased the adhesion of the chemical coating.
Fig. 7. XPS spectra of the main metals in the metal block samples and quartz glass samples of fs-LIBDE; (a-d) metal block samples; (a1-d1) quartz glass samples of fs-LIBDE.
EDS surface scans of the seed layer were introduced by Fs-LIBDE in the bottom and edge regions of the micro slots, as shown in Fig. 8. As depicted in Figs. 8(a-d), the distribution of metal particles on the surface of the microsatellite grooves prepared by fs-LIBDE was consistent with the morphology of copper micropattern deposited on the surface of the microsatellite grooves (Fig. 5(c)). According to the results of copper micropattern deposition, it can be seen that Al particles had the most potent catalysts for electroless copper plating, but the distribution of Al particles was too dispersed, which was not conducive to preparing the copper micropattern. Furthermore, as shown in Fig. 8(e), the content of metal particles in the microgrooves prepared with stainless steel, Al, and Cu as the substrate materials was far lower than that in the edge area of microgrooves. On the contrary, the content of metal particles in the microgrooves prepared with Zr-based amorphous alloys as the matrix material was much higher than that in the edge area of the microgrooves.
Fig. 8. Surface scan EDS results for different areas: (a) Fig. 6(a2), (b) Fig. 6(b2), (c) Fig. 6(c2) and (d) Fig. 6(d2); (e) Fs-LIBDE introduces active factor mass ratio in the bottom and edge area of the microgroove.
The ablation threshold of four kinds of metal matrix materials was measured as follows: Zr-based amorphous alloys (4.08 J /cm2) > Cu (1.7 J /cm2) > Al (1.3 J /cm2) > stainless steel (0.36 J /cm2). As shown in Fig. 8, when stainless steel, Al and Cu were used as the substrate materials, their ablation threshold was small and the interaction between laser and substrate material was intense. Therefore, many metal particles were sputtered in the edge area of microgrooves, while the distribution of metal particles in the microgrooves was relatively sparse. However, when Zr-based amorphous alloys were used as the substrate material, their ablation threshold is higher, and the relative removal rate of the laser and Zr-based amorphous alloys metal was relatively low. As a result, the metal particles were mainly distributed in the interior of microgrooves, while there were almost no metal particles at the edge of the microgrooves. In other words, the smaller the ablation threshold was, the more intense the fs-LIBDE reaction was and the more dispersed the metal particle injected. The larger the ablation threshold, the slower the fs-LIBDE reaction was and the more concentrated the metal particle injected. As a result, the more concentrated the distribution of metal particles on the surface of the microgrooves prepared by this method, the better the quality of the deposited metal micropatterns was. Consequently, it could be inferred that the distribution of metal particles was related to the ablation threshold of the material and that high threshold non-precious metal materials could be used instead of precious metal materials to reduce costs in the method of preparing metal micropatterns on quartz glass surfaces by fs-LIBDE.
A high threshold tungsten metal was selected as a substrate material to verify whether copper micropatterns with high bond strength could be prepared. As depicted in Figs. 9 (a1 and a3), the bottom and edge area of the microgroove was a layered composite structure composed of a ripples structure and a large number of nanosphere structures. This structure was basically the same as the microgroove structure in Fig. 6(d). The surface element distribution of the prepared microgrooves was also consistent with the element distribution of Fig. 8(d), as shown in Fig. 9(b). All the detected tungsten elements were mainly distributed inside the microgrooves. The surface morphology of the copper circuit prepared by chemical deposition after ultrasonic cleaning in deionized water for 20 minutes was shown in Fig. 9(c). The copper circuit was tested for adhesion using sandpaper with a grit number of 1500. As shown in Fig. 9(d), the copper circuit surface showed obvious scratches, but the copper circuit was still firmly attached to the quartz glass surface. The polished copper circuit also passed the ultrasonic cleaning and 3M tape test. As depicted in Fig. 9(e), the thickness of the copper microcircuit prepared by chemical deposition was about 2 µm. Since the microchannels prepared by fs-LIBDE were very shallow, the chemical deposition could completely fill the microchannels, so there was no hollow structure in the copper microcircuits. The local enlargement of the copper circuit cross-section showed that the plating formed a molecular diffusion connection with the quartz glass, which was one of the most important reasons for the formation of the anchoring effect (Fig. 9(e1)). Copper microcircuits prepared by fs-LIBDE using metals with high ablation thresholds as substrate materials have withstood adhesion test experiments and meet the requirements of industrial applications. Therefore, the composite structure and metal deposited thin layer was generated by the fs-LIBDE process. The composite structure resulting from fs-LIBDE offered an anchor effect which offered better adhesion for deposited copper. Additionally, the deposited metal thin layer was used as the initial seed layer for copper deposition.
Fig. 9. Microgrooves prepared with metal tungsten as the base material: (a1-a3) SEM; (b) EDS; (c) 20 minutes sonication in water; (d) surface polishing by sandpapers; (e) Cross-sectional morphology of the copper microcircuit; (e1) partial enlargement of the cross-section. Laser parameters: pulse energy = 7.6 µJ; laser scanning speed = 1 mm/s.
4. Applications
Figure 10 showed the selection of optimized parameters for the preparation of different copper micropatterns on quartz glass. The copper circuit had a line width of 18 µm and a resistivity of 1.96 µΩ·cm (Fig. 10(a)). In addition, the edges of the copper microcircuits were neat, the surface morphology was uniform and there were no defects. Figures. 10(b and c) showed a high-resolution metalized complex copper micropattern fabricated on quartz glass to demonstrate its decorative versatility using fs-LIBDE technology. To verify the conductivity of the copper microcircuit, we prepared a zigzag copper micropattern, as shown in Figs. 10(c and d). As shown in Figs. 10(e and f), the LEDs connected to the serrated copper microcircuits work properly when the power was turned on. Thus, it was confirmed that the process method could prepare a fully functional copper micropattern with good performance.
Fig. 10. Copper wire conductivity test; (a) SEM picture of micro-copper circuit; (b, c) Complex microcircuit pattern; (d) Topography of zigzag copper micropattern; (e-f) Simple LED circuit.
Figure 11 demonstrates the application of the prepared copper micropattern to a 4v DC power supply in rapid surface heating. As depicted in Fig. 11(a), the surface temperature of the copper microcircuit rises rapidly after the power was turned on. At 24s, the surface temperature of the circuit had reached 60°C. As the time increases, the circuit surface temperature gradually slowed down. At 100s, the surface temperature of the circuit stabilized at about 106°C. Thus, the faster heating function of this copper micropattern could be used to defog the glass surface. As shown in Fig. 8(b), a large number of small water droplets were sprayed on the glass surface under room temperature conditions (∼25°C). However, under 4v DC power supply conditions, the small water droplets on the glass surface were completely removed in only 30 seconds (Figs. 11(b)–11(e)). Therefore, this device could be used in a typical microsystem for local heating of small areas on the glass surface.
Fig. 11. Application of copper micropatterning in defogging; (a) the temperature of the patterned areas increased rapidly after powering; (b-e) Defogging demonstration; (f-g) application of copper micropatterning in fogging.
Figure 11(f) showed the application of copper micropatterning in fine atomization. First, an appropriate amount of deionized water was sprayed inside the transparent housing and then turned on the DC power supply. As the temperature inside the transparent shell gradually rises and stabilizes, it reached saturation at ∼110°C. At this time, the liquid inside the transparent shell gradually evaporated and adhered to the transparent in the form of micro-droplets on the inner surface of the housing, as shown in Fig. 11(g).
5. Conclusion
In this work, the unique microgroove with layered composite structures and seed layers can be prepared by the fs-LIBDE method using a near-infrared femtosecond laser as the laser source and the high ablation threshold metal as the substrate material. The laser-induced plasma and laser shock remove part of the material to form the layered composite structure and drive the metal particles to impact at high speed and deposit on the backside surface of the glass to form an active layer. Therefore, fs-LIBDE could therefore function as a pre-treatment process for glass because the created rough surface could offer an anchor effect and the thin deposited layer of metal could offer additional adhesion force for further copper deposition.
We further compared the deposition results of different substrate materials and confirmed the anchoring effect of the surface structure of the layered composite and the catalysis of the seed layer to enhance the bonding strength of the deposited metal pattern. This unique surface structure and seed layers can enhance the metal deposition in the chemical plating process. The deposited metal micropatterns demonstrate high resolution (18 µm), low resistance (1.96 µΩ·cm) and high bonding strength to the substrate. The robust metal micropatterns on the glass surfaces can withstand various tests without peeling off or damage. They could be used for the glass heating device and the transparent atomizing device, which may be a potential choice for various microsystems.
Funding
National Natural Science Foundation of China (52075103); Key Project of Regional Joint Fund of Guangdong Basic and Applied Basic Research Foundation (2020B1515120058); Basic and Applied Basic Research Foundation of Guangdong Province (2022A1515010614).
Acknowledgment
This research was performed at Laser Micro/Nano Processing Lab, School of Electromechanical Engineering, Guangdong University of Technology, and it has been sponsored by the National Natural Science Foundation of China (No. 52075103), Key Project of Regional Joint Fund of Guangdong Basic and Applied Basic Research Foundation (2020B1515120058), and Guangdong Basic and Applied Basic Research Foundation (2022A1515010614).
Disclosures
The authors declare no conflicts of interest.
Data availability
Data underlying the results presented in this paper are not publicly available at this time but may be obtained from the authors upon reasonable request.
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