Abstract
High Energy Physics experiments make extensive use of silicon sensors
for tracking purposes. The high granularity of the modern detectors makes
the connection between the segmented sensor channels and the readout electronics
very complex. Furthermore, due to the mismatch between the detector pad pitch
and the electronics a direct connection is not possible in most of the cases.
A new method for the fabrication of pitch adapters is presented using metal-on-glass
technology. In this new method the high-density metal traces are manufactured
by means of laser ablation of the metal layer deposited on top of a glass
substrate. This new procedure is faster, simpler and cheaper than photolithography
for prototyping or low volume production. Different prototypes have been successfully
manufactured and tested for electrical conductivity, bondability and metrology.
Detectors have been assembled using these pitch adapters and tested in particle
beams at CERN.
© 2013 IEEE
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