Abstract
Compound semiconductor nanowires are emerging as attractive and versatile building blocks for the “bottom-up” assembly of photonic devices1, including photodectors2, light-emitting diodes (LEDs)3-5, and lasers6. The ability to assemble and electrically interconnect these building blocks is especially critical since it represents a unique approach to active multi-color device components on a single chip unlike the conventional technologies.
© 2005 Optical Society of America
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