System-on-a-Chip Photonic Integrated Circuits Enabling C+L Band 57.6 Tbps Capacity Long Haul Links

Thomas Frost; Gloria Hoefler; Payam Abolghasem; Lee Dardis; Abdou Diba; Bryan Ellis; Ryan Going; Xian Xu; Ales Kumpera; Scott Corzine; Sanjeev Murthy; Matthias Kuntz; Jianping Zhang; Parmijit Samra; Vikrant Lal; Don Pavinski; Tim Butrie; Jeff Rahn; Steve Sanders; Vince Dominic; Peter Evans; Mehrdad Ziari; Fred Kish

OSA Advanced Photonics Congress (AP) 2019 (IPR, Networks, NOMA, SPPCom, PVLED)
OSA Technical Digest (Optica Publishing Group, 2019),
paper IM3A.1

System-on-a-Chip Photonic Integrated Circuits Enabling C+L Band 57.6 Tbps Capacity Long Haul Links

Thomas Frost, Gloria Hoefler, Payam Abolghasem, Lee Dardis, Abdou Diba, Bryan Ellis, Ryan Going, Xian Xu, Ales Kumpera, Scott Corzine, Sanjeev Murthy, Matthias Kuntz, Jianping Zhang, Parmijit Samra, Vikrant Lal, Don Pavinski, Tim Butrie, Jeff Rahn, Steve Sanders, Vince Dominic, Peter Evans, Mehrdad Ziari, and Fred Kish

Integrated Photonics Research, Silicon and Nanophotonics 2019

Burlingame, California United States
29 July–1 August 2019
ISBN: 978-1-943580-64-4

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Integrated Devices and Circuits (IM3A)

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T. Frost, G. Hoefler, P. Abolghasem, L. Dardis, A. Diba, B. Ellis, R. Going, X. Xu, A. Kumpera, S. Corzine, S. Murthy, M. Kuntz, J. Zhang, P. Samra, V. Lal, D. Pavinski, T. Butrie, J. Rahn, S. Sanders, V. Dominic, P. Evans, M. Ziari, and F. Kish, "System-on-a-Chip Photonic Integrated Circuits Enabling C+L Band 57.6 Tbps Capacity Long Haul Links," in OSA Advanced Photonics Congress (AP) 2019 (IPR, Networks, NOMA, SPPCom, PVLED), OSA Technical Digest (Optica Publishing Group, 2019), paper IM3A.1.

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Abstract

We present multi-channel monolithically integrated InP based photonic integrated circuits emitting in both the C and L bands with 200 Gbps transmission per wavelength, enabling long haul links with up to 57.6 Tbps capacity.

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